
As a natural extension of our design service, VIPER RF offers engineering characterization on-wafer and in test jigs. Our Engineering Laboratory has capability to carry out measurements to 40GHz. For mm-wave frequencies to 110GHz, we have links with state-of-art measurement capabilities.
Our die assembly capability including RF bondwiring allows us to produce engineering test results with rapid leadtimes.
VIPER RF has the expertise to productionize MMICs. We interface with foundry & subcontractors to establish production routes and supply chains.
VIPER RF has capability to test MMIC devices up to 40GHz on a 200mm wafer prober using custom on-wafer probecards.

We have extensive experience of designing custom test jigs to evaluate state-of-art MMICs such as power amplifiers.
VIPER RF has developed die attach and die bonding capability for prototype assembly within its Engineering Laboratory.
Our temperature chamber allows for characterisation of test jigs over the range of -40°C to 85°C.
We have links with major third party commercial vendors to enable designs into full production.
Thermal budgets are considered with design rules to maximize lifetime. We work with qualification test houses as required.